TECHNOLOGY / HYBRID PROCESS

Hybrid lithography: combining maskless and electron beam lithography.

Assign large microscale patterns to DMD exposure and reserve EBL for critical nanoscale structures.

ENGINEERING CONTEXT

The decision starts with the real constraint.

A hybrid flow can reduce unnecessary electron-beam write area while preserving nanoscale capability. Its value depends on cross-tool alignment, resist compatibility, process sequencing and metrology.

Discuss your requirement

CRITICAL REQUIREMENTS

Define these before model selection.

01

Partition the pattern

Identify which layers or geometries require EBL and which can use optical direct write.

02

Share alignment

Design marks and overlay budgets that both exposure systems can use.

03

Validate the process

Record resist, dose, development, metrology and yield for each handoff.

EVIDENCE CHECKLIST

Ask for evidence that closes the decision.

  • Process flow
  • Alignment-mark design
  • SEM and profile data
  • Overlay and yield results

TECHNICAL REVIEW

Turn the requirement into a selection brief.

Send the application, critical parameters and any drawing or process information available.

Discuss your application