Pattern geometry
Minimum feature, equal line/space, grayscale and sidewall-profile targets.
APPLICATION / MEMS & MICROFLUIDICS
Maskless lithography for MEMS and microfluidics.
Use direct-write patterning to accelerate geometry changes, alignment cycles and process learning.
ENGINEERING CONTEXT
The decision starts with the real constraint.
MEMS and microfluidic development often involves frequent layout revisions, varied substrates and multiple layer alignments. The system choice depends on feature size, overlay, sample thickness, resist and required exposure area.
Discuss your requirement ↗CRITICAL REQUIREMENTS
Define these before model selection.
Substrate
Material, size, thickness, flatness and handling constraints.
Process
Resist, wavelength, dose, overlay and inspection method.
SOLUTION ROUTES
Continue from requirement to system.
EVIDENCE CHECKLIST
Ask for evidence that closes the decision.
- Pattern micrograph
- Exposure wavelength and resist
- Overlay measurement method
- Throughput under defined settings
TECHNICAL REVIEW
Turn the requirement into a selection brief.
Send the application, critical parameters and any drawing or process information available.
Discuss your application ↗