APPLICATION / PHOTONICS & MICRO-OPTICS

Lithography workflows for photonics and micro-optics.

Select between grayscale optical patterning and electron-beam writing according to profile and critical dimension.

ENGINEERING CONTEXT

The decision starts with the real constraint.

Photonic structures may combine broad optical features, multilevel topography and critical nanoscale elements. A hybrid process can assign each pattern level to the most suitable exposure technology.

Discuss your requirement

CRITICAL REQUIREMENTS

Define these before model selection.

01

Optical function

Translate target phase, profile or periodicity into lithography requirements.

02

Critical dimension

Separate microscale area patterning from nanoscale critical structures.

03

Layer strategy

Define overlay, alignment marks, resist stack and metrology between exposures.

EVIDENCE CHECKLIST

Ask for evidence that closes the decision.

  • Profile measurement
  • SEM or optical micrograph
  • Resist and development conditions
  • Overlay result

TECHNICAL REVIEW

Turn the requirement into a selection brief.

Send the application, critical parameters and any drawing or process information available.

Discuss your application